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6N137 Datasheet(PDF) 11 Page - Fairchild Semiconductor |
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6N137 Datasheet(HTML) 11 Page - Fairchild Semiconductor |
11 / 12 page ©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com 6N137, HCPL2601, HCPL2611, HCPL2630, HCPL2631 Rev. 1.0.7 11 Tape Specifications Reflow Profile 4.0 ± 0.1 Ø1.55 ± 0.05 User Direction of Feed 4.0 ± 0.1 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 13.2 ± 0.2 4.90 ± 0.20 0.1 MAX 10.30 ± 0.20 10.30 ± 0.20 Ø1.6 ± 0.1 • Peak reflow temperature: 225C (package surface temperature) • Time of temperature higher than 183C for 60–150 seconds • One time soldering reflow is recommended 215 C, 10–30 s 225 C peak Time (Minute) 0 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time above 183C, 60–150 sec Ramp up = 3C/sec |
Similar Part No. - 6N137_08 |
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Similar Description - 6N137_08 |
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