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FM50S3X Datasheet(PDF) 5 Page - Fairchild Semiconductor

Part # FM50S3X
Description  Analog Temperature Sensor
Download  8 Pages
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FM50S3X Datasheet(HTML) 5 Page - Fairchild Semiconductor

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© 2004 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FM50 • Rev. 1.1.1
5
Functional Description
The FM50 contains a thermal diode, calibration
circuits, and amplifiers. Since the FM50 is calibrated
at 33°C, the nominal output in mV is:
VOUT = 830 + 10 • (T-33)
(1)
where T is the thermal junction temperature
expressed in °C.
At 33°C, the tolerances are:
Offset is ±3mV.
Slope is ±0.3mV/°C.
These values accommodate the specified accuracies
at -40, +25, and +125°C.
Output structure is an N-channel CMOS transistor
driving a P-channel load. Available current is typically
50μA to ground. Series resistance is typically 7k
Ω,
charging and 2k
Ω, discharging through a capacitor
connected from VOUT to ground.
Following application of power to VDD, VOUT is
accurate after a delay of approximately 80ms.
Application Information
Although the FM50 is a simple device, care must be
taken to ensure that temperature is measured
accurately. The major sources of errors are:
Voltage Errors
Thermal Delay Errors
Location Errors
Voltage Errors
Figure 6. Recommended Electrical Connections
A Kelvin connection is recommended to avoid errors
due to voltage drops in the ground connections.
Although the typical 130μA supply current draw only
causes a 130μV error; if the series resistance is 1
Ω, a
100mA current supply to adjacent circuits can cause
a 10mV drop across 100m
Ω (10mΩ is a typical value
for soldered joints or contact resistance), leading to a
1°C error. For this reason, the FM50 should be Kelvin
connected, as shown in Figure 6.
T
hermal Delay Errors
For measurement accuracy of the order of tenths of
1°C, adequate settling time must be allowed. For a
typical circuit board installation, 15 minutes should be
allowed to elapse after reading temperature within
1~2°C of the expected final value. Once VOUT has
ceased to slew and is stable (with or without about
±0.1°C noise) for about five minutes, temperature can
be calculated.
Location Errors
Position is source of error. Even within a controlled
thermal environment, changing location by a few
inches can lead to errors of several tenths of 1°C.
Mounting
The FM50 can be easily mounted by gluing or
cementing it to a surface. In this case, its temperature
will be within about 0.2°C of the temperature of the
surface to which it is attached if the ambient air
temperature is almost the same as the surface
temperature. If the air temperature is much higher or
lower than the surface temperature, the actual
temperature of the die will be at an intermediate
temperature between the surface temperature and
the air temperature.
To ensure good thermal conductivity, the backside of
the die is directly attached to the GND pin. The lands
and traces to the FM50 are part of the printed circuit
board, for which the temperature is being measured.
These printed circuit board lands and traces do not
cause the FM50’s temperature to deviate from the
desired temperature.
Alternatively, the FM50 can be mounted inside a
sealed-end metal tube and can be dipped into a bath
or screwed into a threaded hole in a tank. As with any
IC, the FM50 and accompanying wiring and circuits
must be kept insulated and dry to avoid leakage and
corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation
can occur. Printed-circuit coatings and varnishes,
such as Humiseal and epoxy paint or dips, can be
used to ensure that moisture cannot corrode the
FM50 or it connections.


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