Copyright

© ANPEC Electronics Corp.

Rev. B.5 - Mar., 2008

APL1581

www.anpec.com.tw

3

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 2: The maximum allowable power dissipation at any T

(max) = (T

excessive die temperature.

Symbol

Parameter

Rating

Unit

VIN

Input Voltage

7

V

VCNTL

Control Voltage

7

V

PD

Power Dissipation

Internally Limited

W

TJ

Junction Temperature

150

°C

TSTG

Storage Temperature Range

-65 to +150

°C

TSDR

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Current

Limit

Voltage

Regulation

Thermal

Protection

VIN

VCNTL

VOUT

ADJ/GND

VSENSE

Block Diagram

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

Junction-to-Ambient Resistance in free air

(Note 3)

TO-263-5 (Toplayer plane size : 15mm x 15 mm)

TO-252-5 (Toplayer plane size : 10mm x 10 mm)

SOP-8-P (Toplayer plane size : 10mm x 10 mm)

28

42

68

Junction-to-Case Resistance

(Note 4)

TO-220-5

TO-263-5

TO-252-5

3

4

5

Note 3:

θ

rectangular plane, where the devices are mounted, are shown in the table.

Note 4: The case temperature is measured on the TAB of the device mounted on the test board described in Note 3 except the

package TO-220-5. The case temperature of the TO-220-5 is measured on the bottom of the case directly below the die.