Document Number: 28302

For technical questions, contact: aluminumcaps1@vishay.com

www.vishay.com

Revision: 16-May-08

3

153 CLV

Aluminum Capacitors

SMD (Chip) Long Life Vertical

Vishay BCcomponents

Table 2

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print layout

and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig.3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

For maximum conditions refer to Fig.4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION

SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE

GOOD

SOLDERING

CONNECTIONS.

HOWEVER,

THE

SPECIFIED

MAXIMUM

CURVES

SHOULD

NEVER

BE

EXCEEDED.

Table 3

DIMENSIONS in millimeters AND MASS

NOMINAL

CASE SIZE

L xWxH

CASE

CODE

Ø D

SC

MASS

(g)

4.0 x 4.0 x 5.3

0405

4.5

4.5

5.5

4.0

0.8

1.0

2.0 ± 0.2

≈ 0.13

5.0 x 5.0 x 5.3

0505

5.5

5.5

5.5

5.0

0.8

1.4

2.3 ± 0.2

≈ 0.20

6.3 x 6.3 x 5.3

0605

6.8

6.8

5.5

6.3

0.8

2.0

2.7 ± 0.2

≈ 0.30

8.0 x 8.0 x 6.5

0807

8.6

8.6

6.8

8.0

0.8

2.3

3.4 ± 0.2

≈ 0.50

8.0 x 8.0 x 10

0810

8.6

8.6

10.5

8.0

1.1

3.1

3.0 ± 0.2

≈ 1.00

10 x 10 x 10

1010

10.6

10.6

10.5

10.0

1.1

4.7

3.3 ± 0.2

≈ 1.30

10 x 10 x 12

1012

10.6

10.6

12.3

10.0

1.2

4.5

3.9 ± 0.2

≈ 1.40

10 x 10 x 14

1014

10.6

10.6

14.3

10.0

1.2

4.5

3.9 ± 0.2

≈ 1.50

0.4 ± 0.2

W B

CS

L

C

0.3 max.

Fig. 2 Dimensional outline

Fig.3 Recommended solder pad dimensions

RECOMMENDED SOLDERING PAD

DIMENSIONS in millimeters

CASE CODE

a

b

c

0405

2.6

1.6

1.0

0505

3.0

1.6

1.4

0605

3.5

1.6

1.9

0807

4.0

1.6

2.1

0810

3.5

2.5

3.0

1010

4.0

2.5

4.0

1012

4.3

2.5

4.0

1014

4.3

2.5

4.0

280

260

240

220

200

180

160

140

120

100

80

0

50

100

150

200

250

Fig.4 Maximum temperature load during infrared reflow

soldering measured on the soldering pad

t (s)

T

PAD

(°C)