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SI5908DC Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI5908DC Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 6 page FEATURES D TrenchFETr Power MOSFETS D Ultra Low rDS(on) and Excellent Power Handling In Compact Footprint APPLICATIONS D Load Switch D PA Switch D Battery Switch Si5908DC Vishay Siliconix New Product Document Number: 73074 S-41641—Rev. A, 06-Sep-04 www.vishay.com 1 Dual N-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (Ω) ID (A) 0.040 @ VGS =4.5 V 5.9 20 0.045 @ VGS =2.5 V 5.6 0.052 @ VGS =1.8 V 5.2 Bottom View D1 G1 S1 N-Channel MOSFET 1206-8 ChipFETr S1 G1 S2 G2 D1 D1 D2 D2 1 Marking Code CC XXX Lot Traceability and Date Code Part # Code Ordering Information: Si5908DC-T1—E3 D2 G2 S2 N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA =25_C UNLESS OTHERWISE NOTED) Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS 20 V Gate-Source Voltage VGS 8 V Continuous Drain Current (TJ = 150_C)a TA =25_C ID 5.9 4.4 Continuous Drain Current (TJ = 150_C)a TA =85_C ID 4.2 3.1 A Pulsed Drain Current IDM 20 A Continuous Source Current (Diode Conduction)a IS 1.8 0.9 Maximum Power Dissipationa TA =25_C PD 2.1 1.1 W Maximum Power Dissipationa TA =85_C PD 1.1 0.6 W Operating Junction and Storage Temperature Range TJ,Tstg --55 to 150 _C Soldering Recommendations (Peak Temperature)b, c 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit M i J ti t A bi ta t ≤ 5sec R 50 60 Maximum Junction-to-Ambienta Steady State RthJA 90 110 _C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 30 40 C/ Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon- nection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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