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ACAC06121K1J1K1P5 Datasheet(PDF) 4 Page - Vishay Siliconix |
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ACAC06121K1J1K1P5 Datasheet(HTML) 4 Page - Vishay Siliconix |
4 / 6 page Document Number: 28751 For technical questions, contact: filmresistors.thinfilmarray@vishay.com www.vishay.com Revision: 11-Sep-08 279 ACAC 0612, ACAS 0612 - Precision Precision Thin Film Chip Resistor Array Vishay Beyschlag APPLICATION INFORMATION DESCRIPTION The production of the components is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade (96 % Al2O3) ceramic substrate and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are realised on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3*. ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using reflow or vapour phase as shown in IEC 61760-1*. For ACAC resistor arrays automatic soldering using wave can also be used. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The permitted storage time is 20 years, whereas the solderability is specified for 2 years after production or requalification. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2002/95/EC Restriction of the use of Hazardous Substances directive (RoHS) • 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) APPROVALS Where applicable, the resistors are tested in accordance with EN 140401-801 which refers to EN 60115-1 and EN 140400. Notes (1) Global Automotive Declarable Substance List, see www.gadsl.org (2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issues → environment policy → chemicals → chemicals for electronics • The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents R1 R2 R3 R4 Circuit Type 03 |
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