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Document Number: 94313

2

Revision: 06-Jun-08

MBRD3..PbF Series

Note

Note

(1)

thermal runaway condition for a diode on its own heatsink

ELECTRICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

TYP.

MAX.

UNITS

Maximum forward voltage drop

See fig. 1

3 A

0.48

0.6

V

6 A

0.58

0.7

3 A

0.41

0.49

6 A

0.55

0.625

Maximum reverse leakage current

See fig. 2

0.02

0.2

mA

10.7

20

Typical junction capacitance

189

-

pF

Typical series inductance

Measured lead to lead 5 mm from package body

5.0

-

nH

Maximum voltage rate of change

dV/dt

-

10 000

V/µs

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction temperature range

- 40 to 150

°C

Maximum storage temperature range

- 40 to 175

Maximum thermal resistance,

junction to case

DC operation

See fig. 4

6.0

°C/W

Maximum thermal resistance,

junction to ambient

80

Approximate weight

0.3

g

0.01

oz.

Marking device

Case style D-PAK (similar to TO-252AA)

MBRD320

MBRD330

MBRD340

dP

tot

dT

J

-------------

1

R

thJA

--------------

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