DESCRIPTION (CONTINUED)

ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

(1)

bq24230

bq24232

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The battery is charged in three phases: conditioning, constant current, and constant voltage. In all charge

phases, an internal control loop monitors the IC junction temperature and reduces the charge current if the

internal temperature threshold is exceeded.

The charger power stage and charge current sense functions are fully integrated. The charger function has

high-accuracy current and voltage regulation loops, charge status display, and charge termination. The input

current limit and charge current are programmable using external resistors.

ORDERING INFORMATION

PART

OPTIONAL

MARKING

FUNCTION

bq24230RGTR

6.6 V

4.4 V

TD

CGN

bq24230RGTT

6.6 V

4.4 V

TD

CGN

bq24232RGTR

10.5 V

4.4 V

ITERM

NXK

bq24232RGTT

10.5 V

4.4 V

ITERM

NXK

(1)

The RGT package is available in the following options:

R - taped and reeled in quantities of 3000 devices per reel.

T - taped and reeled in quantities of 250 devices per reel.

(2)

This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for

use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including

bromine (Br) or antimony (Sb) above 0.1% of total product weight.

over the 0°C to 125°C operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

IN (with respect to VSS)

–0.3 to 28

V

OUT (with respect to VSS)

–0.3 to 7

V

Input voltage

BAT (with respect to VSS)

–0.3 to 5

V

EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, TMR, TD,

–0.3 to 7

V

ITERM (with respect to VSS)

Input current

IN

600

mA

OUT

600

mA

Output current (continuous)

BAT (Discharge mode)

600

mA

Output sink current

CHG, PGOOD

15

mA

Junction temperature

–40 to 150

°C

Storage temperature

–65 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

POWER RATING

39.47 °C/W

2.4 °C/W

2.3 W

225 mW

(1)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is

connected to the ground plane by a 2x3 via matrix.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

2

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