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BQ24313DSGR Datasheet(PDF) 14 Page - Texas Instruments

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Part # BQ24313DSGR
Description  OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li CHARGER FRONT-END PROTECTION IC
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

BQ24313DSGR Datasheet(HTML) 14 Page - Texas Instruments

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APPLICATION INFORMATION (WITH REFERENCE TO FIGURE 22)
Selection of RBAT
Selection of RCE, RFAULT, and RPU
Selection of Input and Output Bypass Capacitors
Powering Accessories
bq24313
bq24315
SLUS817A – MARCH 2008 – REVISED NOVEMBER 2008............................................................................................................................................... www.ti.com
It is strongly recommended that the battery not be tied directly to the VBAT pin of the device, as under some
failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as
30V, and applying 30V to the battery in case of the failure of the bq24315 can be hazardous. Connecting the
VBAT pin through RBAT prevents a large current from flowing into the battery in case of a failure of the IC. In the
interests of safety, RBAT should have a high value. The problem with a large RBAT is that the voltage drop across
this resistor, due to the VBAT bias current I(VBAT), causes an error in the BVOVP threshold. This error is over and
above the tolerance on the nominal 4.35V BVOVP threshold.
Choosing RBAT in the range 100kΩ to 470kΩ is a good compromise. In the event of an IC failure, with RBAT equal
to 100k
Ω, the maximum current flowing into the battery would be (30V – 3V) ÷ 100kΩ = 246
µA, which is low
enough to be absorbed by the bias currents of the system components. RBAT equal to 100kΩ results in a
worst-case voltage drop of RBAT × I(VBAT) = 1mV. This is negligible to compared to the internal tolerance of 50mV
on BVOVP threshold.
If the Bat-OVP function is not required, the VBAT pin should be connected to VSS.
The CE pin can be used to enable and disable the IC. If host control is not required, the CE pin can be tied to
ground or left un-connected, permanently enabling the device.
In applications where external control is required, the CE pin can be controlled by a host processor. As in the
case of the VBAT pin (see above), the CE pin should be connected to the host GPIO pin through as large a
resistor as possible. The limitation on the resistor value is that the minimum VOH of the host GPIO pin less the
drop across the resistor should be greater than VIH of the bq24315 CE pin. The drop across the resistor is given
by RCE × IIH.
The FAULT pin is an open-drain output that goes low during OV, OC, battery-OV, and OT events. If the
application does not require monitoring of the FAULT pin, it can be left unconnected. But if the FAULT pin has to
be monitored, it should be pulled high externally through RPU, and connected to the host through RFAULT. RFAULT
prevents damage to the host controller if the bq24315 fails (see above). The resistors should be of high value, in
practice values between 22k
Ω and 100kΩ should be sufficient.
The input capacitor CIN in Figure 22 is for decoupling, and serves an important purpose. Whenever there is a
step change downwards in the system load current, the inductance of the input cable causes the input voltage to
spike up. CIN prevents the input voltage from overshooting to dangerous levels. It is recommended that a ceramic
capacitor of at least 1
µF be used at the input of the device. It should be located in close proximity to the IN pin.
COUT in Figure 22 is also important: If a fast (< 1µs rise time) overvoltage transient occurs at the input, the
current that charges COUT causes the device’s current-limiting loop to start, reducing the gate-drive to FET Q1.
This results in improved performance for input overvoltage protection. COUT should also be a ceramic capacitor of
at least 1
µF, located close to the OUT pin. C
OUT also serves as the input decoupling capacitor for the charging
circuit downstream of the protection IC.
In some applications, the equipment that the protection IC resides in may be required to provide power to an
accessory (e.g. a cellphone may power a headset or an external memory card) through the same connector pins
that are used by the adapter for charging. Figure 24 and Figure 25 illustrate typical charging and
accessory-powering scenarios:
14
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq24313 bq24315


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