VREF

0.010 Ω

0.010 Ω

Q2 (ACFET)

SI4435

Q3(BATFET)

SI4435

P

P

ACN

ACP

/ACDRV

ACDET

/ACGOOD

SRSET

ACSET

VREF

CELLS

/CHGEN

VDAC

VADJ

ADC

IADAPT

HOST

PVCC

/BATDRV

HIDRV

PH

BTST

REGN

LODRV

PGND

SRP

SRN

P

PACK+

PACK-

SYSTEM

ADAPTER +

ADAPTER -

/ACGOOD

AGND

bq24750A

2.2 µF

C1

432 kΩ

1%

66.5 kΩ

1%

R1

R2

10 kΩ

R5

1 µF

C4

100 pF

C5

0.1 µF

C8

Q4

FDS6680A

Q5

FDS6680A

0.1 µF

C9

L1

8.2 µH

D1

BAT54

1 µF

C10

BAT

VREF

TS

PACK

THERMISTER

SENSE

5.6 kΩ

1%

R3

118 kΩ

1%

R4

/DPMDET

10 kΩ

R6

ACOP

Q1 (ACFET)

SI4435

10 µF

C6

C15

0.1 µF

C16

0.47 µF

0.1 µF

C2

C3

2 Ω

R10

0.1 µF

PowerPad

10 µF

C7

10 µF

C12

C14

0.1 µF

C13

0.1 µF

C11

10 µF

GPIO

VREF

VREF

100 kΩ

R8

66.5 kΩ

R9

100 kΩ

R7

43 kΩ

R11

VREF

REGN

PACKAGE THERMAL DATA

bq24750A

A.

Figure 2. Typical System Schematic, Voltage and Current Programmed by Resistor

ORDERING INFORMATION

ORDERING NUMBER

PART NUMBER

PACKAGE

QUANTITY

(TAPE and REEL)

bq24750ARHDT

250

bq24750A

28-PIN 5 x 5 mm QFN

bq24750ARHDR

3000

over operating free-air temperature range (unless otherwise noted)

POWER RATING

DERATING FACTOR ABOVE

PACKAGE

θ

JA

39 °C/W

2.36 W

0.028 W/°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is

connected to the ground plane by a 2x3 via matrix.

Copyright © 2008, Texas Instruments Incorporated

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