©1996 Fairchild Semiconductor Corporation

www.fairchildsemi.com

NC7SZ126 Rev. 1.10.0

9

Physical Dimensions

Figure 4. 5-Lead SOT23, JEDEC MO-178, 1.6mm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

5

1

4

3

2

LAND PATTERN RECOMMENDATION

B

A

L

C

0.10 C

0.20

C A B

0.60 REF

0.55

0.35

SEATING PLANE

0.25

GAGE PLANE

8°

0°

NOTES: UNLESS OTHEWISE SPECIFIED

A) THIS PACKAGE CONFORMS TO JEDEC

MO-178, ISSUE B, VARIATION AA,

B) ALL DIMENSIONS ARE IN MILLIMETERS.

1.45 MAX

1.30

0.90

0.15

0.05

1.90

0.95

0.50

0.30

3.00

2.60

1.70

1.50

3.00

2.80

C

0.95

0.95

2.60

0.70

1.00

SEE DETAIL A

0.22

0.08

C) MA05Brev5

TOP VIEW

(0.30)