ACPM-7821-TR1 datasheet(10/16 Pages) AVAGO

Part #	ACPM-7821-TR1

Description	4 x 4 Power Amplifier Module for J-CDMA (898 - 925 MHz)

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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10

PCB Design Guidelines

The recommended ACPM-7821 PCB Land pattern is

shown in Figure 14 and Figure 15. The substrate is

coated with solder mask between the I/O and con-

ductive paddle to protect the gold pads from short

circuit that is caused by solder bleeding/bridging.

Stencil Design Guidelines

A properly designed solder screen or stencil is

required to ensure optimum amount of solder paste

is deposited onto the PCB pads.

The recommended stencil layout is shown in Figure

16. Reducing the stencil opening can potentially

generate more voids. On the other hand, stencil open-

ings larger than 100% will lead to excessive solder

paste smear or bridging across the I/O pads or

conductive paddle to adjacent I/O pads. Considering

the fact that solder paste thickness will directly affect

the quality of the solder joint, a good choice is to use

laser cut stencil composed of 0.100 mm (4 mils) or

0.127 mm (5 mils) thick stainless steel which is capable

of producing the required fine stencil outline.

Figure 14. Metallization.

Figure 15. Solder Mask Opening.

Figure 16. Solder Paste Stencil Aperture.

0.25

0.85

0.4

0.7

0.6

Ø 0.3mm

on 0.6mm pitch

0.1

0.8

0.5

0.65

0.85

2.0

0.6

1.8

0.8 x 0.5

0.8 x 0.6

0.7

0.6

1.6

0.85

0.4

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ACPM-7821-TR1 Datasheet(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED

ACPM-7821-TR1 Datasheet(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED

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