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TC5F-020.0M Datasheet(PDF) 4 Page - Connor-Winfield Corporation |
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TC5F-020.0M Datasheet(HTML) 4 Page - Connor-Winfield Corporation |
4 / 4 page Table 13.0 Package Ceramic Surface Mount Package. 2111 Comprehensive Drive Aurora, Illinois 60505 Phone: 630-851-4722 Fax: 630-851-5040 www.conwin.com US Headquarters: 630-851-4722 European Headquarters: +353-61-472221 Bulletin Page Revision Date Tx180 4of4 05 25 Aug 2008 Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation 120°C 150°C 180°C 260°C 0 220°C 360 Sec. Max. 120 S Max. 10 S 60 S Max. Time Temperature 260°C 90% 50% 10% 200 mV/Div 0 Design Recommendations 1 Tape and Reel Specifications OSC TOP LAYER GROUND LAYER BOTTOM LAYER Output Buffer 50 Ohm Trace Without Vias Model TA5C-020.0MHz Typical Phase Noise Solder Profile LVCMOS Output Waveform Clipped Sinewave Output Waveform Package Characteristics Environmental Characteristics Table 14.0 Vibration: Vibration per Mil Std 883E Method 2007.3 Test Condition A Shock: Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B. Soldering: SMD product suitable for Convection Reflow soldering. Peak temperature 260 C. Maximum time above 220 C, 60 seconds. Solderability Solderability per Mil Std 883E Method 2003 Suggested Pad Layout Vcc, should have a large copper area for reduced inductance. Connect a 0.01uF bypass capacitor <0.1”(2.54mm) from the pad. Ground, should have a large copper area for reduced inductance. 0.010”(0.254mm) Recommended clearance inductance for internal copper flood. Top View 1 3 4 5 6 8 9 10 Buffer Ground 50 Ohm trace <1”by design Vcc Ground Top View 0.215 (5.46mm) 0.037 (0.94mm) 0.051 (1.28mm) 0.051 (1.28mm) 0.295 (7.49mm) 0.030 (0.76mm) Keep Out Area Top View 1 Dimensional Tolerance: ±.005 (.127mm) ±.02 (.508mm) |
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