3-16

TELCOM SEMICONDUCTOR, INC.

ABSOLUTE MAXIMUM RATINGS*

Forward Current .................................................... +10mA

Reverse Current .................................................... +30mA

Storage Temperature Range ................ – 65

°C to +150°C

Operating Temperature Range

TO-92 Package ..................................... 0

°C to +70°C

COA Surface Mount Package ............... 0

°C to +70°C

Lead Temperature (Soldering, 10 sec)

TO-92 Package .............................................. +300

°C

COA Surface Mount Package ........................ +300

°C

Power Dissipation

Limited by Forward/Reverse Current

*Functional operation above the absolute maximum stress ratings is not

implied.

TC9491

OUTPUT

INPUT

36 k

Ω

RESPONSE TIME TEST CIRCUIT

TC9491A

TC9491B

Symbol

Parameter

Test Conditions

Min

Typ

Max

Min

Typ

Max

Unit

Reverse Breakdown Voltage

1.200

1.22

1.250

1.200

1.220

1.250

V

1.180

—

1.290

1.219

—

1.260

Minimum Operating Current

µA

—

8.0

15

—

8.0

15

—

20

—

—

20

Reverse Breakdown Voltage

Change with Current

—

—

1.0

—

—

1.0

—

—

1.5

—

—

1.5

mV

—

10

—

—

20

—

20

—

—

25

Z

Reverse Dynamic Impedance

—

0.6

—

—

0.6

—

Ω

10

—

—

50

—

—

100

ppm/

°C

S

Long Term Stability

—

20

—

—

20

—

ppm/kHR

LOW POWER, BANDGAP

VOLTAGE REFERENCES

TC9491A

TC9491B