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TCL1117-5.00 Datasheet(PDF) 4 Page - TelCom Semiconductor, Inc |
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TCL1117-5.00 Datasheet(HTML) 4 Page - TelCom Semiconductor, Inc |
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4 / 9 page  4 PRELIMINARY INFORMATION TCL1117-05 6/5/97 TCL1117 TCL1117-2.85 TCL1117-3.30 TCL1117-5.00 800mA LOW DROPOUT POSITIVE REGULATORS ADJUSTABLE AND FIXED 2.85V, 3.30V, 5.00V Table 1. Thermal Copper Area Resistance Topside* Backside Board Area (Junction-to-Ambient) 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45 °C/W 1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45 °C/W 225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53 °C/W 100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59 °C/W 1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52 °C/W 1000 Sq. mm 0 1000 Sq. mm 55 °C/W *Tab of device attached to topside copper Soldering Methods The recommended methods of soldering the SOT-223 package are: vapor phase re-flow and infrared re-flow with component preheat within 65 °C of the solder temperature. Hand soldering and wave soldering methods are not recom- mended since they can damage the part with excessive thermal gradients across the surface area of the package. Thermal shock to the package (>30 °C per second) must be minimized. Ripple Rejection Ripple Rejection curves were generated using an ad- justable output TCL1117 with a bypass capacitor from ADJ to ground. To obtain the performance shown in the curves, the impedance of the bypass capacitor (at the ripple fre- quency) should be less than R1. R1 is typically 100 Ω to 200 Ω. For example at 120Hz, with R1 = 100Ω, the adjust capacitor should be at least 13 µF. Only 0.16µF would be required at 10kHz. The output ripple increases as the ratio of the output voltage to the reference voltage (VOUT/VREF) in fixed voltage devices, and adjustable devices without an adjust pin ca- pacitor. For example, at 5V, output ripple will increase by a factor of 4 (5/1.25V). Ripple rejection will be reduced by 12db from the value shown on the curve. Power Dissipation and Thermal Design As mentioned earlier, the TCL1117 has thermal over- load protection which limits internal temperature to +165 °C. However, device functionality is only guaranteed to a maxi- mum junction temperature of +125 °C. Since internal power dissipation can be >1 watt, careful thermal design is essen- tial. The TCL1117 is supplied in a SOT-223 package which is intended to be directly surface-mounted to the PC-board. Because there is no dedicated heat sink, power dissipation to ambient is performed largely by the PC board and its copper material. The power dissipation and junction temperature for the TCL1117 in a SOT-223 are given by the following equations: PD = (VIN – VOUT) x (IOUT) TJUNCTION = TAMBIENT + (PD x ΘJA) NOTE: TJUNCTION must not exceed 125°C The ΘJC (junction to external tab) for the SOT-223 is 15 °C/W. Depending upon heatsink parameters, the ΘCA can be as low as 30 °C/W. Therefore, the total thermal resistance ( ΘJA) is at least 45°C/W. Table 1 shows thermal resistance measurements taken with the TCL1117 mounted on 1/16 inch 2-layer PCB with 1oz. copper foil. NOTE: The TAB pin does not have to be soldered to all copper layers for effective heat transfer. Use Table 1 only as a rough guide since thermal interactions with adjacent components cannot be predicted. Figure 3. Connections for Best Load Regulation CONNECT R1 TO CASE CONNECT R2 TO LOAD Rp PARASITIC LINE RESISTANCE R2 R1 RL OUT IN TCL1117 ADJ VIN |
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