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TCN4040C-2.5EOA Datasheet(PDF) 2 Page - TelCom Semiconductor, Inc

Part # TCN4040C-2.5EOA
Description  PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
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Manufacturer  TELCOM [TelCom Semiconductor, Inc]
Direct Link  http://www.telcom-semi.com
Logo TELCOM - TelCom Semiconductor, Inc

TCN4040C-2.5EOA Datasheet(HTML) 2 Page - TelCom Semiconductor, Inc

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TCN4040
2
PRELIMINARY INFORMATION
TCN4040-01 6/16/97
PRECISION MICROPOWER
SHUNT VOLTAGE REFERENCE
ELECTRICAL CHARACTERISTICS: Boldface type specifications apply for TA = TJ = TMIN to TMAX. All other specifica-
tions; TA = TJ = 25°C.
TCN4040CEOA
TCN4040DEOA
TCN4040EENB
TCN4040CENB
TCN4040DENB
TCN4040EEZB
TCN4040CEZB
TCN4040DEZB
Symbol Parameter
Test
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Conditions
VR
Reverse Breakdown
IR =100µA
2.500
2.500
2.500
V
Voltage
Notes 4, 5
Reverse Breakdown
IR =100µA—
±12
±25
±50
mV
Voltage Tolerance
Notes 4, 5, 6
±29
±49
±74
IRMIN
Minimum Operating
Notes 4, 5
45
60
45
65
45
65
µA
Current
65
70
70
∆VR/∆T
Average Reverse
IR =10mA
±20
±100
±20
±150
±20
±150
ppm/
°C
Breakdown Voltage
IR =1mA
±15
±15
±15
Temperature
IR =100µA
±15
±15
±15
Coefficient
Notes 4, 5
∆VR/∆IR
Reverse Breakdown
IRMIN ≤ IR ≤ 1mA
0.4
0.8
0.4
1.0
0.4
1.0
mV
Voltage Change with Notes 4, 5
1.0
1.2
1.2
Operating Current
Change
1mA
≤ IR =12mA
2.3
6.0
2.3
8.0
2.3
8.0
mV
8.0
10.0
10.0
ZR
Reverse Dynamic
IR =1mA, f = 120Hz,
0.3
0.9
0.3
1.1
0.3
1.1
Impedance
IAC = 0.1 IR
Notes 4, 5
ABSOLUTE MAXIMUM RATINGS* (Note 1)
Reverse Current. ....... ...............................................20mA
Forward Current ....... ................................................10mA
Power Dissipation (TA = 25°C) (Note 2)
SOT-23B-3 Package ...................................... 230mW
TO-92 Package .............................................. 440mW
SO-8 Package ................................................ 470mW
Storage Temperature ........................... – 65
°C to + 150°C
Lead Temperature (Soldering, 10 seconds)
EOA ................................................................ +260
°C
ENB ................................................................ +300
°C
EZB ................................................................. +300
°C
ESD Susceptibility
Human Body Model (Note 3) ................................ 2kV
Machine Model (Note 3) .................................... .200V
*Functional operation above the absolute maximum stress rating is not
implied.
OPERATING RATINGS (NOTES 1 AND 2)
Temperature Range
(TMIN ≤ TA ≤ TMAX) ..................... – 40°C ≤ TA ≤ +85°C
Reverse Current
TCN4040-2.5 ...................................... .60
µA to 15mA
NOTES: 1. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which
the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
Electrical
Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when
the device is not operated under the listed test conditions.
2. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), θJA
(junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is
PDMAX = (TJMAX – TA) /θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the TCN4040, TJMAX = 125°C, and
the typical thermal resistance (
θJA), when board mounted, is 185°C/W for the M package, 326°C/W for the SOT-23B-3 package, and 180°
C/W with 0.4” lead length and 170
°C/W with 0.125” lead length for the TO-92-3 package.
3. The human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.


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