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OP07C Datasheet(HTML) 2 Page - Texas Instruments

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Part No. OP07C
Description  PRECISION OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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OP07C Datasheet(HTML) 2 Page - Texas Instruments

   
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OP07C, OP07D, OP07Y
PRECISION OPERATIONAL AMPLIFIERS
SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
OP07Y chip information
These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
OUT
VCC –
VCC+
OFFSET N2
IN –
IN +
OFFSET N1
(4)
(6)
(7)
(8)
(2)
(3)
(1)
+
BONDING PAD ASSIGNMENTS
94
72
(4)
(6)
(7)
(8)
(2)
(3)
(1)


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