WPC03R

01/2009

Page 3

COMMON SPECIFICATIONS

Specifications typical at T

These devices are intended for wave soldering or manual soldering.

They are not intended to be subject to surface mount processes under any circumstances.

The normal wave soldering process can be used with these devices where the device is subjected to a maximum wave temperature of 260°C for a period of

no more than 10 seconds. Within this time and temperature range, the integrity of the device’s plastic body will not be compromised and internal temperatures

within the converter will not exceed 175°C. Care should be taken to control manual soldering limits identical to that of wave soldering.

THROUGH-HOLE SOLDERING INFORMATION

Parameter

Conditions

Min

Typ

Max

Units

Input

Voltage Range

9

12

18

Vdc

18

24

36

Vdc

34

48

72

Vdc

Reflected Ripple Current

50

mA p-p

Isolation

Safety Standards

Designed to meet requirements of

EN60950, EN41003 & UL1950

Rated Voltage

“L” Pinout

1500

Vdc

“E” Pinout

1000

Vdc

Test Voltage—60 Hz, 10 secs

“L” Pinout

1500

Vpk

“E” Pinout

1000

Vpk

Resistance

10

G

Capacitance

220

pF

Leakage Current

V

30

Arms

Output

Rated Power

3

W

Voltage Setpoint Accuracy

+3.0

%

Temperature Coefficient

+0.02

%/°C

Line Regulation-singles

Low line to high line

+1.5%

%

Line Regulation-duals

Low line to high line

+1.5%

%

Load Regulation-singles

Min load to rated load

+2%

%

Load Regulation-duals

Min load to rated load

+2%

%

Ripple & Noise

BW=5 Hz to 20 MHz

50

100

mV p-p

General

Switching Frequency

Variable Frequency Min - Max

70

225

kHz

MTTF per MIL-HDBK-217, Rev F

1,000,000

Hours

Weight

12

g

Temperature

Operation

-40

+85

°C

Storage

-55

+125

°C