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SN74HC08PWR Datasheet(PDF) 5 Page - Texas Instruments |
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SN74HC08PWR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 14 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 5962-8404701VCA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC 5962-8404701VDA ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC 84047012A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC 8404701CA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC 8404701DA ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC JM38510/65203B2A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC JM38510/65203BCA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC JM38510/65203BDA ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC SN54HC08J ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC SN74HC08D ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74HC08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DT ACTIVE SOIC D 14 250 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74HC08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HC08N3 OBSOLETE PDIP N 14 None Call TI Call TI SN74HC08NSR ACTIVE SO NS 14 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74HC08PW ACTIVE TSSOP PW 14 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74HC08PWLE OBSOLETE TSSOP PW 14 None Call TI Call TI SN74HC08PWR ACTIVE TSSOP PW 14 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74HC08PWT ACTIVE TSSOP PW 14 250 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SNJ54HC08FK ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC SNJ54HC08J ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC SNJ54HC08W ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC SNV54HC08J ACTIVE CDIP J 14 None Call TI Call TI SNV54HC08W ACTIVE CFP W 14 None Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. PACKAGE OPTION ADDENDUM www.ti.com 8-Mar-2005 Addendum-Page 1 |
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