CAT4101TV-T75 datasheet(8/11 Pages) ONSEMI

Part #	CAT4101TV-T75

Description	1 A Constant-Current LED Driver with PWM Dimming

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CAT4101

Doc. No. MD-5036, Rev. D

8

Characteristics subject to change without notice

APPLICATION INFORMATION

SINGLE 12 V SUPPLY

The circuit shown in Figure 3 shows how to power

three LEDs in series from a single 12 V supply using

the CAT4101. The CAT4101 can not be driven

directly from 12 V, three components are needed to

create a lower voltage for the VIN pin (below 5.5 V).

Resistor R2 and zener diode D provide a regulated

voltage while the quiescent current runs through the

N-Channel transistor M. Suitable parts for this circuit

are the ON Semiconductor MM3Z6V2 zener diode

and the 2N7002L N-channel transistor (SOT23

package).

Figure 3. Single Supply Driving Three LEDs

POWER DISSIPATION

The power dissipation (PD) of the CAT4101 can be

calculated as follows:

() (

)

LED

IN

D

I

V

I

V

P

×

+

×

=

where

VLED is the voltage at the LED pin.

Combinations of high VLED voltage or high ambient

temperature can cause the CAT4101 to enter

thermal shutdown. In applications where VLED is

high, a resistor can be inserted in series with the

LED string to lower PD.

Thermal dissipation of the junction heat consists

primarily of two paths in series. The first path is the

junction to the case (

θ

JC) thermal resistance which is

defined by the package style, and the second path is

the case to ambient (

θ

CA) thermal resistance, which

is dependent on board layout. The overall junction to

ambient (

θ

JA) thermal resistance is equal to:

θ

JA = θJC + θCA

For a given package style and board layout, the

operating junction temperature TJ is a function of the

power dissipation PD, and the ambient temperature,

resulting in the following equation:

TJ = TAMB + PD (θJC + θCA) = TAMB + PD θJA

The CAT4101 TO-263 5-lead package provides a

thermal resistance when the ground tab is soldered

down to the PCB. When mounted on a double-sided

printed circuit board with two square inches of

copper allocated for “heat spreading”, the resulting

θ

JA is about 30°C/W.

For example, at 60°C ambient temperature, the

maximum power dissipation is calculated as follow:

W

3

30

60

150

T

P

JA

AMB

Jmax

Dmax

=

θ

=

-

RECOMMENDED LAYOUT

The board layout should provide good thermal

dissipation through the PCB. Multiple via can be

used to connect the tab of the CAT4101 to a large

ground plane underneath the package.

Input capacitor C1 should be placed as close to the

driver IC as possible. The RSET resistor should

have a Kelvin connection to the GND pin of the

CAT4101.

Figure 4. CAT4101 Recommended Layout

VIN

R2

5 k

Ω

D

6.2 V

M

CAT4101

12 V

R1

C1

0.1 µF

EN/PWM

RSET

LED

GND

C2

1 µF

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