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CAT4104VP2-GT3 Datasheet(PDF) 10 Page - ON Semiconductor |
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CAT4104VP2-GT3 Datasheet(HTML) 10 Page - ON Semiconductor |
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10 / 14 page  CAT4104 Doc. No. MD-5041 Rev. B 10 © 2009 SCILLC. All rights reserved. Characteristics subject to change without notice VIN CAT4104 5 V VCC R1 1436 Ω M1 C1 0.1 µF EN/PWM RSET LED1 LED2 LED3 LED4 GND 350 mA C2 1 µF R2 5 k Ω RPTC Figure 6. LED Current Derating POWER DISSIPATION The power dissipation (PD) of the CAT4104 can be calculated as follows: () ( ) LEDN LEDN IN IN D I V I V P × Σ + × = where VLEDN is the voltage at the LED pin, and ILEDN is the LED current. Combinations of high VLEDN voltage and high ambient temperature can cause the CAT4104 to enter thermal shutdown. In applications where VLEDN is high, a resistor can be inserted in series with the LED string to lower the power dissipation PD. Thermal dissipation of the junction heat consists primarily of two paths in series. The first path is the junction to the case ( θ JC) thermal resistance which is defined by the package style, and the second path is the case to ambient ( θ CA) thermal resistance, which is dependent on board layout. The overall junction to ambient ( θ JA) thermal resistance is equal to: θ JA = θJC + θCA For a given package style and board layout, the operating junction temperature TJ is a function of the power dissipation PD, and the ambient temperature, resulting in the following equation: TJ = TAMB + PD (θJC + θCA) = TAMB + PD θJA When mounted on a double-sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting θ JA is about 90°C/W for the TDFN-8 package, and 160°C/W for the SOIC-8 package. For example, at 60°C ambient temperature, the maximum power dissipation for the TDFN-8 is calculated as follow: W 1 90 60 150 T T P JA AMB Jmax Dmax = = θ = - - RECOMMENDED LAYOUT A small ceramic capacitor should be placed as close as possible to the driver VIN pin. The RSET resistor should have a Kelvin connection to the GND pin of the CAT4104. The board layout should provide good thermal dissipation through the PCB. In the case of the CAT4104VP2 in the TDFN package, a via can be used to connect the center tab to a large ground plane underneath as shown on figure 7. Figure 7. CAT4104 Recommended Layout |
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Similar Description - CAT4104VP2-GT3 |
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