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IMP5112CDPT Datasheet(PDF) 2 Page - A1 PROs co., Ltd. |
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IMP5112CDPT Datasheet(HTML) 2 Page - A1 PROs co., Ltd. |
2 / 6 page 2 408-432-9100/www.impweb.com © 2002 IMP, Inc. Pin Configuration Ordering Information Absolute Maximum Ratings1 8 T2 1 T7 DW Package 9T3 7 T1 10 T4 6 DISCONNECT* 11 VTERM 5 GND 12 HEAT SINK/GND 4 HEAT SINK/GND 13 HEAT SINK/GND 3 T9 14 NC 2 T8 15 T5 16 T6 5111/5112__02.eps IMP5111 IMP5112 * DISCONNECT (IMP5111) DISCONNECT (IMP5112) SO-16 * DISCONNECT (IMP5111) DISCONNECT (IMP5112) 12 T2 1 T7 PW Package 13 T3 7 HEAT SINK/GND 18 HEAT SINK/GND 8 HEAT SINK/GND 17 HEAT SINK/GND 9 HEAT SINK/GND 16 NC 10 DISCONNECT* 15 VTERM 11 T1 14 T4 6 HEAT SINK/GND 19 HEAT SINK/GND 5 GND 20 HEAT SINK/GND 4 NC 21 NC 3 T9 22 NC 2 T8 23 T5 24 T6 5111/5112_02a.eps IMP5111 IMP5112 TSSOP-24 r e b m u N t r a Pe g n a R e r u t a r e p m e Te g a k c a P P D C 1 1 1 5 P M I0° 5 2 1 o t C °CO S c i t s a l P n i p - 6 1 T P D C 1 1 1 5 P M I0° 5 2 1 o t C °CO S c i t s a l P n i p - 6 1 , l e e R d n a e p a T P W P C 1 1 1 5 P M I0° 5 2 1 o t C °CP O S S T c i t s a l P n i p - 4 2 T P W P C 1 1 1 5 P M I0° 5 2 1 o t C °CP O S S T c i t s a l P n i p - 4 2 , l e e R d n a e p a T P D C 2 1 1 5 P M I0° 5 2 1 o t C °CO S c i t s a l P n i p - 6 1 T P D C 2 1 1 5 P M I0° 5 2 1 o t C °CO S c i t s a l P n i p - 6 1 , l e e R d n a e p a T P W P C 2 1 1 5 P M I0° 5 2 1 o t C °CP O S S T c i t s a l P n i p - 4 2 T P W P C 2 1 1 5 P M I0° 5 2 1 o t C °CP O S S T c i t s a l P n i p - 4 2 , l e e R d n a e p a T 3 t a . 1 0 t _ 2 1 1 5 / 1 1 1 5 Thermal Data TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . +7V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V Regulator Output Current . . . . . . . . . . . . . . . . . . 0.4A Operating Junction Temperature Plastic (DP, PWP Packages) . . . . . . . . . . . . . . . 150 °C Note: 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. Storage Temperature Range . . . . . . . . . . . . . . . . . -65 °C to 150°C Lead Temperature (Soldering, 10 seconds) . . . . . 300 °C DP Package: Thermal Resistance Junction-to-Leads, θJL . . . . . . . . 20°C/W Thermal Resistance Junction-to-Ambient, θJA . . . . . . 50°C/W PW Package: Thermal Resistance Junction-to-Leads, θJL . . . . . . . . 27°C/W Thermal Resistance Junction-to-Ambient, θJA . . . . . . 100°C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the ambient airflow is assumed. IMP5 IMP511111/5 1/5111122 IMP5 IMP511111/5 1/5111122 |
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