NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

18.06.2008

8. RELIABILITY & TEST CONDITION :

40(1.575)

100(3.937)

10±0.5

seconds

60

seconds

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

Bending

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

W

Flexture Strength

right conditions.

45(1.772)

20(.787)

45(1.772)

W

Terminal Strength

Solderability

150°C

4±1.0

seconds

right conditions.

60

seconds

More than 90% of the terminal electrode

should be covered with solder.

Preheating

230°C

Dipping

Natural

cooling

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

> 25

Force (Kfg)

Size

4

0.5

For A Series :

Time (sec)

Solder : Sn-Ag3.0-Cu0.5

Flux for lead free : rosin

Dip Time : 4±1sec.

Preheat : 150°C, 60sec.

Solder Temperature : 230±5°C

Refer to standard electrical characteristics list

Temperature Rise Test

Solder Heat Resistance

Electrical Characteristics Test

Rated Current

Impedance

DC Resistance

Impedance change : Within ±30%

Appearance : No significant abnormality

Preheating

260°C

150°C

Natural

Dipping

cooling

30°C max. ( t)

ITEM

PERFORMANCE

2. Temperature measured by digital surface thermometer.

Dip Time : 10±0.5sec.

Solder Temperature : 260±5°C

Solder : Sn-Ag3.0-Cu0.5

Preheat : 150°C, 60sec.

Flux for lead free : rosin

HP4291A, HP4287A+16192A

1. Applied the allowed DC current.

HP4338B

TEST CONDITION

No mechanical damage

Remaining terminal electrode : 70% Min.

FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)

A4K SERIES