PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN74LVC245ADBLE

OBSOLETE

SSOP

DB

20

None

Call TI

Call TI

SN74LVC245ADBR

ACTIVE

SSOP

DB

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LVC245ADGVR

ACTIVE

TVSOP

DGV

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

SN74LVC245ADW

ACTIVE

SOIC

DW

20

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

SN74LVC245ADWR

ACTIVE

SOIC

DW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

SN74LVC245AGQNR

ACTIVE

VFBGA

GQN

20

1000

None

SNPB

Level-1-240C-UNLIM

SN74LVC245AN

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

SN74LVC245ANSR

ACTIVE

SO

NS

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LVC245APW

ACTIVE

TSSOP

PW

20

70

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC245APWLE

OBSOLETE

TSSOP

PW

20

None

Call TI

Call TI

SN74LVC245APWR

ACTIVE

TSSOP

PW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC245APWT

ACTIVE

TSSOP

PW

20

250

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

SN74LVC245ARGYR

ACTIVE

QFN

RGY

20

1000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

SN74LVC245AZQNR

ACTIVE

VFBGA

ZQN

20

1000

Pb-Free

(RoHS)

SNAGCU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Addendum-Page 1