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AH322-S8G Datasheet(PDF) 8 Page - TriQuint Semiconductor |
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AH322-S8G Datasheet(HTML) 8 Page - TriQuint Semiconductor |
8 / 8 page . TriQuint Semiconductor, Inc • Phone 1-800-951-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com April 2009 AH322 2W High Linearity InGaP HBT Amplifier Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Mounting Configuration / Land Pattern Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contact the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. Product Marking The component will be marked with an “AH322G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1A Value: Passes ≥ 250V to < 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class III Value: Passes ≥ 1000V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Function Pin No. Iref 8 Input 3 Output / Vcc 6, 7 Vbias 1 GND Backside Paddle GND 2, 4, 5 1 2 3 4 8 7 6 5 |
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