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AH322-S8G Datasheet(PDF) 2 Page - TriQuint Semiconductor

Part # AH322-S8G
Description  2W High Linearity InGaP HBT Amplifier
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Manufacturer  TRIQUINT [TriQuint Semiconductor]
Direct Link  http://www.triquint.com
Logo TRIQUINT - TriQuint Semiconductor

AH322-S8G Datasheet(HTML) 2 Page - TriQuint Semiconductor

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TriQuint Semiconductor, Inc • Phone 1-800-951-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
April 2009
AH322
2W High Linearity InGaP HBT Amplifier
Typical Device Data
S-Parameters (Vcc = +5 V, Icq = 500 mA, T = 25 °C, calibrated to device leads)
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
Gain and Maximum Stable Gain
-5
0
5
10
15
20
25
30
35
40
45
2.14 GHz
7.19 dB
2.14 GHz
22.7 dB
DB(MSG())
De_emebedded S_parameter
DB(|S(2,1)|)
De_emebedded S_parameter
10 .
0
5.
0
3
.
0
4.
0
-0
.2
-
0
.
4
S11
Swp Max
4GHz
Swp Min
0.01GHz
2.14 GHz
r 0.493722
x 0.825153
10 .
0
5.
0
3
.
0
4.
0
-0
.2
-
0
.
4
S22
Swp Max
4GHz
Swp Min
0.01GHz
2.14 GHz
r 0.0838672
x 0.36526
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in pink color, [DB (S (2, 1)]. For a tuned circuit for a
particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in
the blue line [DB (GMAX)].
The impedance plots are shown from 0.01 – 4 GHz, with markers placed in 0.5 GHz increments.
S-Parameters (Vcc = +5 V, Icq = 500 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-0.74
-174.58
29.75
109.51
-43.47
25.51
-1.15
-135.3
100
-0.53
-179.31
24.21
98.59
-43.22
17.83
-1.22
-157.31
200
-0.45
176.71
18.46
89.55
-42.49
8.135
-1.19
-170.3
400
-0.44
170.07
12.77
80.82
-42.04
5.31
-1.22
-178.39
600
-0.56
163.11
9.78
73.71
-41.41
10.52
-1.18
176.07
700
-0.61
159.9
8.73
69.49
-41.21
11.31
-1.12
173.93
800
-0.64
156.03
7.94
65.68
-40.26
12.5
-1.17
171.69
1000
-0.78
147.66
6.8
56.95
-39.65
7.88
-1.22
166.82
1200
-0.87
138.49
6.11
46.99
-38.34
2.45
-1.26
162.15
1400
-1.08
128.32
5.8
36.79
-37.99
-3.1
-1.33
157.29
1600
-1.4
117.39
5.83
25.05
-37.52
-14.57
-1.49
152.31
1800
-1.94
106.19
6.17
10.83
-37.39
-27.07
-1.46
147.31
2000
-3.2
95.9
6.8
-7.89
-37.45
-42.22
-1.41
143.05
2200
-5.84
94.01
7.36
-33.75
-38.56
-69.38
-1.21
138.4
2400
-6.52
112.96
6.5
-64.88
-41.93
-115.31
-0.9
133.24
2600
-4.45
121.06
4.77
-92.83
-41.83
167.17
-0.4
126.56
2800
-2.44
117.78
2.24
-121.06
-38.13
103.07
-0.27
119.41
3000
-1.26
108.49
-1.12
-142.85
-34.99
62.15
-0.35
112.36
Application Circuit PC Board Layout
Circuit Board Material: Top RF layer is .014” Getek, єr = 4.0, 4 total layers (0.062” thick) for mechanical rigidity
1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning
shunt capacitors – C8, C5 and C2. The markers and vias are spaced in .050” increments.


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