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THS4031 Datasheet(PDF) 3 Page - Texas Instruments |
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THS4031 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 38 page THS4031, THS4032 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS SLOS224C – JULY 1999 – REVISED APRIL 2000 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 functional block diagram OUT 8 6 1 IN– IN+ 2 3 Null – + 1OUT 1IN– 1IN+ VCC 2OUT 2IN– 2IN+ –VCC 8 6 1 2 3 5 7 4 – + – + Figure 1. THS4031 – Single Channel Figure 2. THS4032 – Dual Channel absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC– 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO 150 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VIO ±4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature, TA: C-suffix 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-suffix –40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M-suffix –55 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg –65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package 300 °C . . . . . . . . . . . . . . . . . . . . Case temperature for 60 seconds, FK package 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE θJA θJC TA = 25°C PACKAGE JA ( °C/W) JC ( °C/W) A POWER RATING D 167‡ 38.3 740 mW DGN§ 58.4 4.7 2.14 W JG 119 28 1050 mW FK 87.7 20 1375 mW ‡ This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the θJA is 95°C/W with a power rating at TA = 25°C of 1.32 W. § This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in. PC. For further information, refer to Application Information section of this data sheet. |
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