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THS6022CPWP Datasheet(PDF) 4 Page - Texas Instruments |
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THS6022CPWP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 38 page THS6022 250-mA DUAL DIFFERENTIAL LINE DRIVER SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 functional block diagram _ + Driver 1 Driver 2 _ + 3 4 5 11 10 2 1 12 13 14 VCC+ VCC+ VCC– VCC– 1OUT 2 OUT 1 IN+ 1 IN– 2 IN+ 2 IN– absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC– 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO (see Note 1) 400 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VID 6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation at (or below) TA = 25°C (see Note 1) 3.3 W . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free air temperature, TA –40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg –65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6022 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could permanently damage the device. See the Thermal Information section of this document for more information about PowerPad technology. recommended operating conditions MIN NOM MAX UNIT Supply voltage VCC and VCC Split supply ±4.5 ±16 V Supply voltage, VCC+ and VCC – Single supply 9 32 V Operating free-air temperature TA C Suffix 0 70 °C O erating free-air tem erature, TA I Suffix –40 85 °C |
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