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THS6032GQE Datasheet(PDF) 1 Page - Texas Instruments |
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THS6032GQE Datasheet(HTML) 1 Page - Texas Instruments |
1 / 31 page THS6032 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER SLOS233C – APRIL1999 – REVISED MARCH 2000 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Low Power ADSL Line Driver Ideal for Central Office – 1.35-W Total Power Dissipation for Full-Rate ADSL Into a 25- Ω Load D Low-Impedance Shutdown Mode – Allows Reception of Incoming Signal During Standby D Two Modes of Operation – Class-G Mode: 4 Power Supplies, 1.35 W Power Dissipation – Class-AB Mode: 2 Power Supplies, 2 W Power Dissipation D Low Distortion – THD = –62 dBc at f = 1 MHz, VO(PP) = 20 V, 25-Ω Load – THD = –69 dBc at f = 1 MHz, VO(PP) = 2 V, 25-Ω Load D 400-mA Minimum Output Current Into a 25- Ω Load D High Speed – 65-MHz Bandwidth (– 3dB) , 25- Ω Load – 100-MHz Bandwidth (– 3dB) , 100- Ω Load – 1200 V/ µs Slew Rate D Thermal Shutdown and Short Circuit Protection D Evaluation Module Available description The THS6032 is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power consumption to 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number of power supplies to two. HIGH-SPEED xDSL LINE DRIVER/RECEIVER FAMILY DEVICE DRIVER RECEIVER 5 V ±5 V ±15 V DESCRIPTION THS6002 • • • • 500-mA differential line driver and receiver THS6012 • • • 500-mA differential line driver THS6022 • • • 250-mA differential line driver THS6032 • • • 500-mA low-power ADSL central-office line driver THS6062 • • • • Low-noise ADSL receiver THS6072 • • • Low-power ADSL receiver THS7002 • • • Low-noise programmable-gain ADSL receiver CAUTION: The THS6032 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. Copyright © 2000, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 PAD† VCCH– 1OUT VCCL– 1IN– 1IN+ NC SHDN1 SHDN2 PAD† PAD† VCCH+ 2OUT VCCL+ 2IN– 2IN+ NC NC DGND PAD† THERMALLY ENHANCED SOIC (DWP) PowerPAD ™ PACKAGE (TOP VIEW) NC – Not Connected † This terminal is internally connected to the thermal pad. Cross section view showing PowerPAD (SIDE VIEW) MicroStar Junior ™ (GQE) PACKAGE (TOP VIEW) PowerPAD and MicroStar Junior are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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