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TL061MJG Datasheet(PDF) 6 Page - Texas Instruments |
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TL061MJG Datasheet(HTML) 6 Page - Texas Instruments |
6 / 23 page TL061, TL061A, TL061B, TL061Y, TL062, TL062A TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL064Y chip information This chip, when properly assembled, has characteristics similar to the TL064. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with conductive epoxy or a gold-silicon preform. Bonding-Pad Assignments Chip Thickness: 15 Mils Typical Bonding Pads: 4 × 4 Mils Minimum TJ(max) = 150°C Tolerances Are ±10%. All Dimensions Are in Mils. Pin (11) is Internally Connected to Backside of Chip. + – 1OUT 1IN+ 1IN– VCC+ (4) (6) (3) (2) (5) (1) – + (7) 2IN+ 2IN– 2OUT (11) VCC– + – 4OUT 4IN+ 4IN– (13) (10) (9) (12) (8) – + (14) 3OUT 3IN+ 3IN– 60 110 (13) (14) (1) (2) (3) (5) (6) (7) (8) (9) (10) (12) (11) (4) |
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