Electronic Components Datasheet Search |
|
TLC25M4A Datasheet(PDF) 3 Page - Texas Instruments |
|
TLC25M4A Datasheet(HTML) 3 Page - Texas Instruments |
3 / 21 page TLC254, TLC254A, TLC254B, TLC254Y, TLC25L4, TLC25L4A, TLC25L4B TLC25L4Y, TLC25M4, TLC25M4A, TLC25M4B, TLC25M4Y LinCMOS ™ QUAD OPERATIONAL AMPLIFIERS SLOS003F – JUNE 1983 – REVISED AUGUST 1994 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 chip information These chips, when properly assembled, display characteristics similar to the TLC25_4C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (11) VDD– /GND + – 3OUT 3IN + 3IN – (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN – BONDING PAD ASSIGNMENTS 68 108 (14) (13) (12) (11) (10) (9) (8) (7) (6) (5) (5) (4) (3) (2) (1) |
Similar Part No. - TLC25M4A |
|
Similar Description - TLC25M4A |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |