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TLC556LD Datasheet(PDF) 3 Page - Texas Instruments |
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TLC556LD Datasheet(HTML) 3 Page - Texas Instruments |
3 / 18 page TLC556, TLC556Y DUAL LinCMOS ™ TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC556Y chip information These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. OUT DISCH R1 R S 1 RESET CONT VDD THRESH R R R GND TRIG (3) (5) (1) BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS NO BACKSIDE METALLIZATION PIN (7) INTERNALLY CONNECTED TO BACKSIDE OF CHIP FUNCTIONAL BLOCK DIAGRAM (EACH TIMER) (4) (14) (2) (6) (7) 61 97 |
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