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NQ04W33SMA16 Datasheet(PDF) 11 Page - SynQor Worldwide Headquarters |
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NQ04W33SMA16 Datasheet(HTML) 11 Page - SynQor Worldwide Headquarters |
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11 / 13 page  Input: Input: Outputs: Outputs: Current: Current: PPackage: ackage: 2.4 - 6.0V 2.4 - 6.0V 0.75 - 3.6V 0.75 - 3.6V 16A 16A SMT SMT T Technical S echnical Specification pecification Product # NQ04W33SMA16 Phone 1-888-567-9596 www.synqor.com Doc.# 005-2NV4S3E Rev. B 11/26/07 Page 11 Thermal Performance (SMA16): While impossible to be exact, a simplified thermal model for the mounted converter is detailed below. • Rt_J-Pcb models the conduction of heat from the converter's hottest junction to the converter's PCB at large. It is about 3oC/W for converters running at higher output voltage, and about 4oC/W for lower voltage converters. • Rt_Pcb-Amb models the power dissipation from converter PCB to the air stream. It ranges from about 15oC/W at 400LFM to about 25oC/W 100LFM. • Rt_Pcb-Feet expresses the thermal path from the converter's PCB though its mounting feet; it is about 3oC/W. • Rt_spread models the heat spreading on the PCB to which the converter is mounted and is largely dependent upon the con- struction and layout of that PCB. • T_mount is the temperature of that PCB in the greater vicinity of the converter. As is evident, the values for Rt_spread and T_mount will have great effect upon the thermal operation of the converter. With Rt_Pcb-Amb being 5 to 8 times as large as Rt_Pcb-Feet, in most applications these converters will be predominantly cooled via thermal conduction through their feet. Airflow and T_Amb will have only a minimal cooling effect. • Rt_spread should be minimized. Attach the converter to large copper planes, on multiple layers, with multiple vias near the mounting feet. • T_mount should also be minimized. Place the converter far enough away from other sources of heat on the PCB so that it is as cool as practical. • If operation near derating limits is even suspected, thermal per- formance should be verified with the unit mounted in its intend- ed manner and powered in circuit with all neighboring circuit- ry active. Attach a thermocouple to the converter's hotspot as shown in Figures 4, 6, and 8 in the Performance Curves sec- tion. SURFACE MOUNT INFORMATION PCB Layout Considerations: SynQor recommends that the customer use a non-solder mask defined pad design. The mini- mum recommended pad size is 0.074" x 0.122" (1.88mm x 3.1mm) and the maximum pad size is 0.095" x 0.140" (2.41mm x 3.56mm), see the mechanical diagram on page 2. Interconnection to internal power planes is typically required. This can be accomplished by placing a number of vias between the SMT pad and the relevant plane. The number and location of the vias should be determined based on electrical resistance, current and thermal requirements. "Via-in-pad" design should be avoided in the SMT pads. Solder mask should be used to elimi- nate solder wicking into the vias. Pick and Place: The NiQor surface mount modules are designed for automated assembly using standard SMT pick and place equipment. The modules have a centrally located inductor component with a flat surface area to be used for component pick-up. The units use open frame construction and have a low mass that is within the capability of standard pick and place equipment. Those modules however have a larger mass than most conventional SMT components and so variables such as nozzle size, tip style, handling speed, and placement pressure should be optimized for best results. A conformal tipped place- ment nozzle design is recommended. Coplanarity of better than 0.004" (0.1mm) is achieved through the SMT NiQor's terminal design. Figure I: Thermal Model for NQ04 Surface Mount |
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