Electronic Components Datasheet Search |
|
TLV2352 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
TLV2352 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 21 page TLV2352, TLV2352Y LinCMOS ™ DUAL LOW-VOLTAGE DIFFERENTIAL COMPARATORS SLCS011B – MAY 1992 – REVISED MARCH 1999 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2352Y chip information These chips, when properly assembled, display characteristics similar to the TLV2352. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip can be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – OUT IN + IN – VDD GND (8) (6) (3) (2) (5) (1) – + (7) IN + IN – OUT (4) 57 57 (7) (6) (5) (8) (4) (3) (2) (1) |
Similar Part No. - TLV2352 |
|
Similar Description - TLV2352 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |