TLV5510

2.7-V TO 3.6-V 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER

SLAS124C– DECEMBER 1997 – REVISED DECEMBER 1999

11

POST OFFICE BOX 655303

APPLICATION INFORMATION

The following notes are design recommendations that should be used with the TLV5510.

reduce system noise.

production process. Breadboards should be copper clad for bench evaluation.

A good method to use is twisted-pair cables for the supply lines to minimize noise pickup. An analog and

digital ground plane should be used on PCB layouts when additional logic devices are used. The AGND

and DGND terminals of the device should be tied to the analog ground plane.

placed as close as possible to the appropriate device terminals. A ceramic chip capacitor is recommended

for the 0.01-

µF capacitor. Care should be exercised to assure a solid noise-free ground connection for the

analog and digital grounds.

D0–D7. If possible, AGND traces should be placed on both sides of the ANALOG IN traces on the PCB for

shielding.

should be 10

Ω or less within the analog frequency range of interest.