TMS3473B

PARALLEL DRIVER

SOCS022B – NOVEMBER 1990

4

POST OFFICE BOX 655303

4.4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–11.1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–8 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

15.2 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Unmounted device (see Figure 3)

825 mW

. . . . . . . . . . . . . .

Mounted device (see Figure 3)

1150 mW

. . . . . . . . . . . . . . . .

–20

°C to 45°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltage values are with respect to GND.

2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for

voltage levels only.

0

1020

3040

50

60

70

0

500

1000

1500

TA – Free-Air Temperature – °C

Mounted Device

(see Note A)

Unmounted Device

POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

100

200

300

400

600

700

800

900

1100

1200

1300

1400

Figure 3

NOTE A: The mounted-device derating curve in Figure 3 is obtained under the following conditions:

The board is 50 mm by 50 mm by 1.6 mm thick.

The board material is glass epoxy.

The copper thickness of all the etch runs is 35 microns.

Etch run dimensions – DW package – All 20 etch runs are 0.4 mm by 22 mm.

Each chip is soldered to the board.

An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.