February 2007

ASM3P1819N

rev 0.3

Low Power Mobile VGA EMI Reduction IC

2 of 7

Notice: The information in this document is subject to change without notice.

Pin Configuration

Pin Description

Pin#

Pin Name

Type

Description

1

XIN

I

Connect to externally generated Clock signal or Crystal.

2

VSS

P

Ground Connection. Connect to system ground.

3

NC

-

No Connect.

4

ModOUT

O

Spread spectrum clock output.

5

REF

O

Non-modulated Reference clock output of the input frequency.

6

PD#

I

Power down control pin. Pull LOW to enable Power-Down mode. This pin

has an internal pull-up resistor.

7

VDD

P

Connect to +3.3V.

8

XOUT

I

Connect to crystal. No connect if externally generated clock signal is used.

Absolute Maximum Ratings

Symbol

Parameter

Rating

Unit

Voltage on any pin with respect to Ground

-0.5 to +4.6

V

Storage temperature

-65 to +125

°C

Operating temperature

-40 to +85

°C

Max. Soldering Temperature (10 sec)

260

°C

Junction Temperature

150

°C

Static Discharge Voltage

(As per JEDEC STD22- A114-B)

2

KV

Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect

device reliability.

Output Frequency and Modulation Rate

Input Frequency Range

(MHz)

Output Frequency Range

(MHz)

Modulation Rate

Spread Deviation

(%)

20 to 40

20 to 40

Input Frequency / 512

-1.25

VSS

REF

1

2

3

5

6

7

8

ASM3P1819N

XIN

NC

ModOUT

PD#

XOUT

VDD

4