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ASM3P622S00KF-16-TR Datasheet(PDF) 5 Page - PulseCore Semiconductor |
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ASM3P622S00KF-16-TR Datasheet(HTML) 5 Page - PulseCore Semiconductor |
5 / 16 page May 2007 ASM3P622S00A/B/J/E/K rev 0.4 Low Frequency Timing-Safe™ Peak EMI Reduction IC 5 of 16 Notice: The information in this document is subject to change without notice. Pin Description for ASM3P622S00K Pin # Pin Name Description 1 XIN/CLKIN Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 2 XOUT Crystal connection. If using an external reference, this pin must be left unconnected. 3 CLKOUT1 1 Buffered clock output 4 VDD 3.3V supply 5 SS% 2 Spread Spectrum Selection 6 GND Ground 7 CLKOUT2 1 Buffered clock output 8 CLKOUT3 1 Buffered clock output 9 SSON 2 Spread Spectrum enable and disable option. When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum. 10 CLKOUT4 1 Buffered clock output 11 CLKOUT5 1 Buffered clock output 12 GND Ground 13 VDD 3.3V supply 14 CLKOUT6 1 Buffered clock output 15 CLKOUT7 1 Buffered clock output 16 CLKOUT 1 Buffered clock output Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on these Inputs 3. Buffered clock outputs are Timing-Safe™ Spread Spectrum Control and Input-Output Skew Table Device Input Frequency SS % Deviation Input-Output Skew(±TSKEW) 0 ±0.25 % 0.063 ASM3P622S00A/B/J/E/K 12MHz 1 ±0.50 % 0.125 Note: TSKEW is measured in units of the Clock Period Absolute Maximum Ratings Symbol Parameter Rating Unit VDD Voltage on any pin with respect to Ground -0.5 to +4.6 V TSTG Storage temperature -65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. |
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Similar Description - ASM3P622S00KF-16-TR |
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