TPS1101, TPS1101Y

SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

SLVS079C – DECEMBER 1993 – REVISED AUGUST 1995

2

POST OFFICE BOX 655303

schematic

NOTE A: For all applications, all source terminals should be

connected and all drain terminals should be connected.

SOURCE

DRAIN

GATE

ESD-

Protection

Circuitry

TPS1101Y chip information

This chip, when properly assembled, displays characteristics similar to the TPS1101. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

80

92

TPS1100Y

(2)

(6)

(1)

(3)

(7)

(8)

(5)

(4)

DRAIN

SOURCE

SOURCE

SOURCE

GATE

DRAIN

DRAIN

DRAIN

(2)

(1)

(3)

(4)

(6)

(7)

(8)

(5)