TPS71025

LOW-DROPOUT VOLTAGE REGULATOR

SLVS162A – MAY 1997 – REVISED MAY 1998

3

POST OFFICE BOX 655303

Terminal Functions

TERMINAL

NAME

NO.

DESCRIPTION

NAME

D or P

PW

EN

2

6

Enable input. Logic low enables output

GND

1

1–3

Ground

IN

3, 4

8–10

Input supply voltage

OUT

5, 6

13, 14

Output voltage

SENSE

7

15

Output voltage sense input

TPS71025Y chip information

These chips, when properly assembled, display characteristics similar to those of the TPS71025. Thermal

compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

(4)

(3)

(2)

(1)

GND

OUT

IN

EN

TPS71025

80

92

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

(2)

(5)

(4)

(3)

(1)

BONDING PAD ASSIGNMENTS

SENSE

(5)

NOTE A: For most applications, OUT and SENSE should

be tied together as close as possible to the device;

for other implementations, refer to SENSE-pin

connection

discussion

in

the

Application

Information section of this data sheet.