EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

Gain

Stage

+ EQ

RBBDC

VBB

Self−Biasing Network

LineEndTermination

VCC

VCC

ESD

IN+

IN−

= 50 W

= 50 W

VOCM

OUT−

OUT+

49.9 W

49.9 W

1 pF

PACKAGE THERMAL CHARACTERISTICS

SN65LVCP418

Figure 1. Equivalent Input Circuit Design

Figure 2. Common-Mode Output Voltage Test Circuit

AVAILABLE OPTIONS

DESCRIPTION

PAP (64 pin)

–40°C to 85°C

Multi Channel Gigabit Signal Conditioner

SN65LVCP418

(1)

The package is available taped and reeled. Add an R suffix to device types (e.g., SN65LVCP418PAP). Temperature range assumes 1

m/s airflow.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

NOM

UNIT

θ

100LFM airflow is required otherwise a 4x4 thermal via

21.2

°C/W

array must be implemented with 6 layer or greater PCB

(1)

See application note SPRA953 for a detailed explaniation of thermal parameters.

4

Submit Documentation Feedback

Copyright © 2009, Texas Instruments Incorporated

Product Folder Link(s): SN65LVCP418