Bump View

1

2

B

C

D

A

Laser Marking View

2

1

B

C

D

A

EN2

1

8

Exposed

Thermal

Die Pad

on

Underside

3

6

GND

2

7

EN1

OC

4

5

TPS22949

TPS22949A

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

SON – DRG

Tape and reel

TPS22949ADRGR

ZUG

–40°C to 85°C

TPS22949YZPR

WCSP – YZP

Tape and reel

TPS22949AYZPR

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZP PACKAGE

YZP PACKAGE TERMINAL ASSIGNMENTS

D

EN1

OC

C

B

GND

A

EN2

2

1

DRG PACKAGE

(TOP VIEW)

The exposed center pad, if used, must be connected as a secondary GND or left electrically open.

TERMINAL FUNCTIONS

TERMINAL

NO.

DESCRIPTION

NAME

YZP

DRG

A1

8

Supply voltage

A2

1

EN2

LDO control input. Active high. Do not leave floating.

B1

7

B2

2

GND

Ground

C1

6

Switch output. Output of the power switch

C2

3

Supply input. Input to the power switch; bypass this input with a ceramic capacitor to ground.

Over current output flag. Active low, open-drain output that indicates an over-current, supply

D1

5

OC

undervoltage, or over-temperature state.

D2

4

EN1

Power switch control input. Active high. Do not leave floating.

(1)

Output voltages from 0.9 V to 3.6 V in 50-mV increments are available through the use of innovative factory EEPROM programming;

minimum order quantities may apply. Contact factory for details and availability.

2

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