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TPS6223-1.5 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS6223-1.5 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page ELECTRICAL CHARACTERISTICS TPS62230 TPS62231 TPS62232 SLVS941 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com VIN = 3.6V, VOUT = 1.8V, EN = VIN, MODE = GND, TA = –40°C to 85°C (1) typical values are at T A = 25°C (unless otherwise noted), CIN = 2.2µF, L = 2.2µH, COUT = 4.7µF, see parameter measurement information PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Input voltage range (2) 2.05 6 V IOUT = 0mA. PFM mode enabled (Mode = 0) 22 40 µA device not switching IOUT = 0mA. PFM mode enabled (Mode = 0) 25 µA IQ Operating quiescent current device switching, VIN = 3.6V, VOUT = 1.2V IOUT = 0 mA. Switching with no load 3 mA (MODE/DATA = VIN), PWM operation, VOUT = 1.8V, L = 2.2µH ISD Shutdown current EN = GND(3) 0.1 1 µA Falling 1.8 1.9 V VUVLO Undervoltage lockout threshold Rising 1.9 2.05 V ENABLE, MODE THRESHOLD VIH TH Threshold for detecting high EN, MODE 2.05 V ≤ VIN ≤ 6V , rising edge 0.8 1 V VIL TH HYS Threshold for detecting low EN, MODE 2.05 V ≤ VIN ≤ 6V , falling edge 0.4 0.6 V IIN Input bias Current, EN, MODE EN, MODE = GND or VIN = 3.6V 0.01 0.5 µA POWER SWITCH High side MOSFET on-resistance 600 850 RDS(ON) VIN = 3.6V, TJmax = 85°C; RDS(ON) max value m Ω Low Side MOSFET on-resistance 350 480 Forward current limit MOSFET 690 850 1050 mA high-side ILIMF VIN = 3.6V, open loop Forward current limit MOSFET low side 550 840 1220 mA TSD Thermal shutdown Increasing junction temperature 150 °C Thermal shutdown hysteresis Decreasing junction temperature 20 °C CONTROLLER TONmin Minimum ON time VIN 3.6V, VOUT = 1.8V, Mode = high, IOUT = 0 mA 135 ns TOFFmin Minimum OFF time 40 ns OUTPUT VREF Internal Reference Voltage 0.70 V VOUT Output voltage accuracy(4) VIN = 3.6V, Mode = GND, device operating in PFM 0% Mode, IOUT = 0mA VIN = 3.6V, MODE = VIN, TA = 25°C –2.0% 2.0% IOUT = 0 mA TA = –40°C to 85°C –2.5% 2.5% DC output voltage load regulation PWM operation, Mode = VIN = 3.6V, VOUT = 1.8 V 0.001 %/mA DC output voltage line regulation IOUT = 0 mA, Mode = VIN, 2.05V ≤ VIN ≤ 6V 0 %/V tStart Start-up Time Time from active EN to VOUT = 1.8V, VIN = 3.6V, 100 µs 10 Ω load ILK_SW Leakage current into SW pin VIN = VOUT = VSW = 3.6 V, EN = GND (5) 0.1 0.5 µA (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application ( θ JA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)). (2) The minimum required supply voltage for startup is 2.05V. The part is functional down to the falling UVL (Under Voltage Lockout) threshold (3) Shutdown current into VIN pin, includes internal leakage (4) VIN = VO + 1.0 V (5) The internal resistor divider network is disconnected from FB pin. 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS62230 TPS62231 TPS62232 |
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