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MF0ICU2001DUD Datasheet(PDF) 3 Page - NXP Semiconductors |
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MF0ICU2001DUD Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 15 page MF0ICU2_SDS_32 © NXP B.V. 2009. All rights reserved. Product short data sheet PUBLIC Rev. 3 — 19 May 2009 171432 3 of 15 NXP Semiconductors MF0ICU2 MIFARE Ultralight C 3. Applications I Public transport I Event ticketing I Prepaid applications I Loyalty schemes I NFC Forum Tag Type 2 I Toy and amusement 4. Quick reference data [1] Stresses above one or more of the limiting values may cause permanent damage to the device. [2] These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied. [3] Exposure to limiting values for extended periods may affect device reliability. [4] LCR meter HP 4285, Tamb = 22 °C, Cp-D, fi = 13.56 MHz, 2 Veff. 5. Ordering information [1] 17 pF version. [2] 50 pF version. Table 1. Quick reference data[1][2][3] Symbol Parameter Conditions Min Typ Max Unit fi input frequency - 13.56 - MHz Ci input capacitance 17 pF version (bare silicon and MOA4) [4] 14.08 16 17.92 pF 50 pF version [4] 44 50 56 pF EEPROM characteristics tcy(W) write cycle time - 4.1 - ms tret retention time Tamb = 22 °C 5 --year Nendu(W) write endurance Tamb = 22 °C 10000 - - cycle Table 2. Ordering information Type number Package Name Description Version MF0ICU2001DUD - 8 inch wafer (sawn, laser diced; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECSII format)[1] - MF0ICU2101DUD - 8 inch wafer (sawn, laser diced; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECSII format)[2] - MF0MOU2001DA4 PLLMC plastic leadless module carrier package; 35 mm wide tape[1] SOT500-2 MF0MOU2101DA4 PLLMC plastic leadless module carrier package; 35 mm wide tape[2] SOT500-2 |
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