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PPC11001DLF13 Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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PPC11001DLF13 Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate High temperature dielectric coating Solder over nickel barrier Metal Glaze™ Surface Mount Precision Power Chip PPC Series • Surge tolerant • Up to 1000 volts • Tight TCR - 25 ppm/°C • Tolerance down to ±0.1% Electrical Data Size Code Industry Footprint IRC Type Power Rating at 70°C (W) Working Voltage Resistance Range (ohms) Tolerance (±%) Qty / Reel (7") Qty / Reel (13") B 1206 PPC1/8 1/8 W 200 100 - 10K 0.1% (B) 0.25% (C) 0.5% (D) 2500 10000 D 2010 PPC1/2 1/2 W 300 100 - 10K 1500 5000 F 2512 PPC1 1 W 350 100 - 10K N/A 5000 H 3610 PPC2 2W 1.33W 500 100 - 10K N/A 1500 Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.5 2.5 x for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Solderability ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent) Life Test ±1% + 0.01 ohm 1200 gram push from underside of mounted chip for 60 seconds Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 1mm so as to exert pull on chip contacts for 5 seconds √ PPC Series Issue November 2008 Sheet 1 of 3 |
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