2

FN6798.1

July 1, 2009

Ordering Information

PART

NUMBER

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

PKG.

DWG. #

ISL89410IP

ISL 89410IP

-40 to +85

8 Ld PDIP

E8.3

ISL89410IPZ (Note)

89410 IPZ

-40 to +85

8 Ld PDIP** (Pb-free)

E8.3

ISL89410IBZ (Note)

89410 IBZ

-40 to +85

8 Ld SOIC (Pb-free)

MDP0027

ISL89410IBZ-T13* (Note)

89410 IBZ

-40 to +85

8 Ld SOIC (Tape and Reel)

(Pb-free)

MDP0027

ISL89411IP

ISL 89411IP

-40 to +85

8 Ld PDIP

E8.3

ISL89411IPZ (Note)

ISL 89411IPZ

-40 to +85

8 Ld PDIP** (Pb-free)

E8.3

ISL89411IBZ (Note)

89411 IBZ

-40 to +85

8 Ld SOIC (Pb-free)

MDP0027

ISL89411IBZ-T13* (Note)

89411 IBZ

-40 to +85

8 Ld SOIC (Tape and Reel)

(Pb-free)

MDP0027

ISL89412IP

ISL 89412IP

-40 to +85

8 Ld PDIP

E8.3

ISL89412IPZ

89412 IPZ

-40 to +85

8 Ld PDIP** (Pb-free)

E8.3

ISL89412IBZ (Note)

89412 IBZ

-40 to +85

8 Ld SOIC (Pb-free)

MDP0027

ISL89412IBZ-T13* (Note)

89412 IBZ

-40 to +85

8 Ld SOIC (Tape and Reel)

(Pb-free)

MDP0027

*Please refer to TB347 for details on reel specifications.

**Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications

NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%

matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

ISL89410, ISL89411, ISL89412