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UCC3912PWPTRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC3912PWPTRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 6 page 2 UCC3912 VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8 V FAULT Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA FAULT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to VIN Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting Input Voltage (B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . –0.3 to VIN Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Operating Junction Temperature Range . . . . –55 °C to +150°C Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300 °C Currents are positive into, negative out of the specified termi- nal. Consult Packaging Section of Databook for thermal limita- tions and considerations of packages. ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TJ = 0 °C to 70°C, VIN = 5V, IMAX = 0.4V, SHTDWN = 2.4V. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Supply Section Voltage Input Range 3.0 8.0 V Supply Current 1.0 2.0 mA Sleep Mode Current SHTDWN = 0.2V 0.5 5.0 µA Output Section Voltage Drop IOUT = 1A 0.15 0.22 V IOUT = 2A 0.3 0.45 V IOUT = 3A 0.45 0.68 V IOUT = 1A, VIN = 3V 0.17 0.27 V IOUT = 2A, VIN = 3V 0.35 0.56 V IOUT = 3A, VIN = 3V 0.5 0.8 V CONNECTION DIAGRAMS *Pin 5 serves as lowest impedance to the electrical ground; Pins 4, 12, and 13 serve as heat sink/ground. These pins should be connected to large etch areas to help dissipate heat. For N package, pins 4, 12, and 13 are N/C. The UCC3912 is designed for unidirectional current flow, emulating an ideal diode in series with the power switch. This feature is particularly attractive in applications where many devices are powering a common bus, such as with SCSI Termpwr. The UCC3912 can be put into sleep mode drawing only 1 µA of supply current. The SHTDWN pin has a preset threshold hysteresis which allows the user the ability to set a time delay upon start-up to achieve sequencing of power. Other features include an open drain FAULT out- put indicator, Thermal Shutdown, Under Voltage Lock- out, and a low thermal resistance Small outline package. DESCRIPTION (cont.) B3 N/C GND* GND* FAULT VIN EGND* GND* GND* VIN N/C GND* SHTDWN GND* B2 GND* GND* CT 12 11 10 9 8 7 6 5 4 3 2 1 13 14 15 16 17 18 19 20 21 22 23 24 IMAX VOUT VOUT B1 B0 GND* TSSOP-24 (Top View) PWP Package DIL-16, SOIC-16 (Top View) N, DP Package *Pin 9 serves as lowest impedance to the electrical ground; other GND pins serve as heat sink/ground. These pins should be connected to large etch areas to help dissipate heat. |
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Similar Description - UCC3912PWPTRG4 |
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