2

UCC3912

VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8 V

FAULT Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA

Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting

Input Voltage

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Operating Junction Temperature Range . . . . –55

°C to +150°C

Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300

°C

Currents are positive into, negative out of the specified termi-

nal. Consult Packaging Section of Databook for thermal limita-

tions and considerations of packages.

ABSOLUTE MAXIMUM RATINGS

°C to 70°C, VIN = 5V,

IMAX = 0.4V, SHTDWN = 2.4V.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Supply Section

Voltage Input Range

3.0

8.0

V

Supply Current

1.0

2.0

mA

Sleep Mode Current

SHTDWN = 0.2V

0.5

5.0

µA

Output Section

Voltage Drop

0.15

0.22

V

0.3

0.45

V

0.45

0.68

V

0.17

0.27

V

0.35

0.56

V

0.5

0.8

V

CONNECTION DIAGRAMS

*Pin 5 serves as lowest impedance to the electrical ground;

Pins 4, 12, and 13 serve as heat sink/ground. These pins

should be connected to large etch areas to help dissipate

heat. For N package, pins 4, 12, and 13 are N/C.

The UCC3912 is designed for unidirectional current flow,

emulating an ideal diode in series with the power switch.

This feature is particularly attractive in applications

where many devices are powering a common bus, such

as with SCSI Termpwr.

The UCC3912 can be put into sleep mode drawing only

1

µA of supply current. The SHTDWN pin has a preset

threshold hysteresis which allows the user the ability to

set a time delay upon start-up to achieve sequencing of

power. Other features include an open drain FAULT out-

put indicator, Thermal Shutdown, Under Voltage Lock-

out, and a low thermal resistance Small outline package.

DESCRIPTION (cont.)

B3

N/C

GND*

GND*

FAULT

VIN

EGND*

GND*

GND*

VIN

N/C

GND*

SHTDWN

GND*

B2

GND*

GND*

CT

12

11

10

9

8

7

6

5

4

3

2

1

13

14

15

16

17

18

19

20

21

22

23

24

IMAX

VOUT

VOUT

B1

B0

GND*

TSSOP-24 (Top View)

PWP Package

DIL-16, SOIC-16 (Top View)

N, DP Package

*Pin 9 serves as lowest impedance to the electrical ground;

other GND pins serve as heat sink/ground. These pins

should be connected to large etch areas to help dissipate

heat.