© IRC Advanced Film Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire Bondable Voltage

Divider Network

DSOT Series

DSOT Series Issue January 2009 Sheet 1 of 3

divider applications that demand precision performance in a wire

bondable package.

The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and minia-

ture physical dimensions. Excellent performance in harsh, humid environments is a trademark of IRC’s self-

For applications requiring high performance voltage dividers in a miniature, wire bondable package, specify

IRC DSOT wire bondable die.

Electrical Data

Resistance Range Each Resistor

10

Ω to 500KΩ

Resistance Range Each Package

to 1.0M

Ω

Absolute Tolerance

to ±0.1%

Ratio Tolerance to R1

to ±0.05%

Absolute TCR

to ±25ppm/°C

Tracking TCR

to ±5ppm/°C

Element Power Rating

125mW @70°C

Package Power Rating

250mW @ 70°C

Rated Operating Voltage

(not to exceed P x R)

100V

Operating Temperature

-55°C to + 150°C

Noise

<-30dB

Substrate Material

Oxidized Silicon

(10KÅ SiO

Substrate Thickness

0.0095˝ ±0.001

(0.241mm ±0.025)

Bond Pad

Metallization

Aluminum

10KÅ minimum

Gold

15KÅ minimum

Backside

Silicon

(gold available)

Passivation

Silicon Dioxide or

Silicon Nitride

Absolute TCR

Commercial

Code

MIL

Inspection

Code*

±300ppm/°C

00

04

±100ppm/°C

01

05

±50ppm/°C

02

06

±25ppm/°C

03

07

TCR/Inspection Code Table

*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection

Power Derating Data

√