42-DL214

點晶科技股份有限公司

SILICON TOUCH TECHNOLOGY INC.

42-DL214-A.03(pre)

-4-

Version：A.03

REQUIREMENTS FOR WAFER DELIVERY

Material： Silicon with P-Substrate

Diameter： 6 inches(≒15cm)

Thickness： 12 mils(≒300um)

Malfunctioned die：Marked with red ink or equivalent marking

HANDLING RECOMMENDATION FOR STATIC ELECTRICITY PROTECTION

(1) Avoid any circumstance that produce static electricity, e.g. rubbing against plastic, during

moving, storing and processing 42-DL214.

(2) Process 42-DL214 in a clean room with proper temperature and humidity.

(3) Ground all working machines and workers wear anti-electrostatic ring to ground during

processing.

(4) Avoid contact 42-DL214 with bare hands .If unavoided, wear anti-electrostatic ring and use

anti-electrostatic tool to pick it up.

GUARANTED TEMPERATURE AND RETENTION CYCLE

(1) The device/wafer 42-DL214 should be stored in the nitrogenous chest. The conditions suggested

are as follows:

Temperature = 23± 3℃

Relative Humidity = 50± 10%

Minimum nitrogen inflow = 3 liters/minute

(2) If the device/wafer, 42-DL214 is incidentally exposed to the air, use it for manufacturing as soon

as possible.

(3) Under the storage environment specified in item (1), six-month safe storage period is

guaranteed.