SI-8001FFE datasheet(5/9 Pages) SANKEN

Part #	SI-8001FFE

Description	DC-to-DC Step-Down Converter

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Manufacturer	SANKEN [Sanken electric]

Direct Link	http://www.sanken-ele.co.jp/en

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SANKEN ELECTRIC CO., LTD.

DC-to-DC Step-Down Converter

SI-8001FFE

27469.057

Thermal Performance Characteristics

24

22

20

18

16

14

12

10

8

6

4

2

0

–40

–20

0

20

40

60

80

Power Dissipation versus Ambient Temperature

Shin Etsu G746 silicon grease

TA (°C)

No heat sink

T

J(max) = 125°C

No heat sink

T

J(max) = 150°C

Al heat sink

75 mm × 75 mm × 2 mm

R

θJA = 7.6°C/W

T

J(max) = 125°C

Al heat sink

100 mm × 200 mm × 2 mm

R

θJA = 5.2°C/W

T

J(max) = 125°C

Al heat sink

200 mm × 200 mm × 2 mm

R

θJA = 2.3°C/W

T

J(max) = 125°C

Infinite heat sink

T

J(max) = 150°C

Infinite heat sink

T

J(max) = 125°C

6

5

4

3

2

1

0

20

40

60

80

100 120 140

180

160

TJ (°C)

Overtemperature

Protection:

Output Voltage versus

Junction Temperature

V

IN = 15 V, IO = 10 mA

OTP On

OTP Off

The application must be designed to ensure that the TJ(max)

of the device is not exceeded during operation. To do so, it is

necessary to determine values for maximum power dissipation,

PD(max), and ambient temperature, TA(max).

PD can be calculated from input values:

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

−

⋅

−

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

−

⋅

=

IN

O

F

x

O

D

V

I

V

I

V

P

1

100

where:

VO is output voltage in V,

VIN is input supply voltage in V,

IO is output current in A,

ηx is IC efficiency in percent (varies with VIN and IO; refer to

efficiency performance curves for value), and

VF is forward voltage for the input diode, Di. In these tests, the

Sanken RK46 was used, at 0.5 V and IO = 3.5 A. For application

design, obtain thermal data from the datasheet for the diode.

PD is substantially affected by the heat conductance properties of

the application, in particular any heatsink connected to the device

radiation fin. The relationships of PD, TA, and heatsink type is

represented in the Power Dissipation chart.

Because the heat dissipation capacity of the heatsink depends

substantively on how it is used in the actual application, thermal

characteristics of the application must be confirmed by testing.

The internal overtemperature protection circuit may enable when

TJ ≥ 130°C.

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